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SPEAR-MX8
NXP i.MX8
The SPEAR-MX8 is a highly scalable System on Module / Computer on Module provides an ideal solution for embedded products requiring advanced performance processing, high-end graphic, UltraHD video capabilities and a variety of high-speed interfaces and connectivity options.
The SPEAR-MX8 is based on NXP i.MX 8QuadMax with Dual 1.6GHz ARM Cortex-A72, Quad 1.2GHz Cortex-A53 and 2x 264MHz real-time Cortex-M4F co-processor. An impressive multimedia performance spec encompasses UltraHD 4K video and display support, high-quality audio, a high performance 2D/3D graphics acceleration and camera/HDMI inputs.
The SoM includes a variety of interfaces and connectivity options: dual GbE, dual USB3, PCIe, SATA III, CAN FD, SPI and UART.
Starting from
159
$
Highlights
CPU
2x 1.6GHz Cortex-A72 + 4x 1.2GHz Cortex-A53 + 2x Cortex M4F
NXP i.MX 8QuadMax / 8QuadPlus
NXP i.MX 8QuadMax / 8QuadPlus
High Speed Interfaces
2x USB3.0, 2x GbE, 2x PCIe, SATA 3
Memory
8 GB RAM, 128 GB eMMC
Temperature range
-40 to 85°C
Video Encode / Decode
4K H.265/H.264 Decode, 1080p60 H.264 Encode
Product Longevity
2034
Display
HDMI 2.0, LVDS, DSI, eDP
Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU
CPU Name
NXP i.MX8 : 8QuadMax / 8QuadPlus
CPU Type
2x Cortex™-A72 + 4x Cortex™-A53
CPU Cores
5-6 Cores
CPU Clock (Max)
1.6 GHz Cortex™-A72,
1.2 GHz Cortex™-A53
1.2 GHz Cortex™-A53
Real-time co-processor
2x 264 MHz Cortex™-M4F
DSP
HiFi 4 DSP
Integer performance (DMIPS)
Up to 28,650
RAM
2 - 8 GB LPDDR4
eMMC
8 - 128 GB
Multimedia
2D/3D Graphics Acceleration
2x Vivante GC7000VX
Video Encode / Decode
4K H.265/H.264 Decode, 1080p60 h.264 Encode
Camera Interfaces
2x MIPI-CSI2
Display
HDMI
V2.0a up to 4Kp60
DSI
MIPI-DSI 1920x1080 24-bit
LVDS
Dual 1920x1080 24-bit
Touch controller
Capacitive
Other
eDP1.4/DP1.3 up to 4Kp60
Audio
Headphone driver
Yes
Microphone
Digital, Analog (stereo)
Digital audio serial interface
I2S(SAI), S/PDIF
Line In/Out
Yes
Connectivity
SD / MMC
x1
USB Host / Device
USB 3.0: 1x OTG, USB 2.0: 1x OTG, 1x Host plus HSIC port
UART
x5, up to 4 Mbps
I2C
x4
SPI
x4
RTC
On carrier
CAN Bus
3x CAN/CAN-FD (Flexible Data-Rate)
PCI-Express
2x Gen 3.0
S-ATA
S-ATA 3
Networking
Ethernet
2x 10/100/1000 Mbps
Linux
Yocto, Debian, Boot2Qt
Android
Yes
FreeRTOS
Yes
Mechanical Specifications
Dimensions (W x L)
68.0 x 55.0 mm
Electronic Specifications
Supply voltage
3.4 – 4.5 V
Digital I/O voltage
3.3 V
Environmental Specifications
Extended operating temperature
-25 to 85°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
SPEAR-MX8[xx]_[xxxx]C_[xxxx]R_[xx]G_[AC]_[EC1]_[EC2]_[LD4]_[X]T
MX8[xx]:
CPU type:
QuadMax 2x Cortex A72 + 4x Cortex A53: QM
QuadPlus 1x Cortex A72 + 4x Cortex A53: QP
QuadMax 2x Cortex A72 + 4x Cortex A53: QM
QuadPlus 1x Cortex A72 + 4x Cortex A53: QP
[xxxx]C:
CPU clock speed: 1600MHz Cortex A72 with 1200MHz Cortex A53: 1612C
[xxxx]R:
LP-DDR4: 2048 MB: 2048R, 4096 MB: 4096R, 8192 MB: 8192R
[xx]G:
eMMC: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G, 128 GB : 128G
[AC]:
Audio Codec
[EC1]:
1st GbE PHY
[EC2]:
2nd GbE PHY
[LD4]
4th LVDS channel (LVDS1 CH1) differential pairs + control signals exported instead of MIPI-DSI0 signals
[x]T:
E: -25 to 85°C, I: -40 to 85°C
Note: All options in [brackets] are optional add-ons that can be either removed or selected from a list of options
Documentation
Our Long-Standing Partnerships
Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.
Evaluation Kit
SPEAR-MX8 Evaluation Kits
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Why Variscite?
Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.
Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.
Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.
Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
09.10.2024 Software releases
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Newsroom
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Blog
Your OS Decision Matters
29.04.2026
