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System On Module- IMX6
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- VAR-SOM-6UL NXP iMX6UL / iMX6ULL / iMX6ULZ
VAR-SOM-6UL
NXP iMX6UL / iMX6ULL / iMX6ULZ
The VAR-SOM-6UL is a highly flexible System on Module (SoM) / Computer on Module (CoM) based on NXP i.MX 6UltraLite / i.MX 6ULL / i.MX 6ULZ ARM Cortex-A7 processor, up to 900MHz CPU Clock. The SoM is a member of Variscite’s VAR-SOM Pin2Pin family and provides a scalable pin-compatible option to i.MX6, i.MX8/ 8X/ 8M/ 8M-Mini and i.MX 8M Nano-based platforms. The Pin2pin family offers Variscite’s customers a high level of scalability, extended lifetime availability and reduced development time, cost and risk.
The VAR-SOM-6UL provides a variety of interfaces and connectivity options – all packaged at an optimized power, size and cost. The SoM's highly integrated connectivity includes a certified single 802.11b/g/n or dual-band WiFi 802.11ac/a/b/g/n, Bluetooth/BLE, dual Ethernet, dual USB, audio, camera in, parallel RGB and LVDS display with touch panel and serial interfaces.
The system supports industrial temperature grades -40 to 85°C and long longevity commitment targeting embedded products in various industrial segments and applications.
The VAR-SOM-6UL integrates into Variscite's VAR-SOM Pin2Pin family, providing scalability across the full performance spectrum and reducing time-to-market when migrating between platforms.
For the complete Pin2pin product list, check the Variscite Pin2Pin System on Module families.
** The Pin2Pin compatibility depends on pinmux options; please verify the detailed pinout table in the related SoM to confirm compatibility is maintained in your specific design.
6ULZ: Z (limited interfaces, 900MHz CT only)
6ULL Y2 : Y2
6UL G2 with extra security features: G2
6UL G3 with full security: G3 (Feature comparison chart)
NAND : 128 MB : 01N, 256 MB : 02N, 512 MB : 05N
eMMC : 8 GB : 8N, 16 GB : 16N, 32 GB : 32N, 64 GB : 64N
Note: Capacitive touch is natively supported through I2C in the base configuration
WBD: Built-in certified WiFi 802.11 ac/a/b/g/n + Bluetooth 5.2/BLE
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Why Variscite?
09.10.2024 
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
