Highlights
CPU
1GHz Cortex™-A8 Texas Instruments AM335x
Real-time CPU
Dual 200MHz PRU
Certified WiFi/Bluetooth
802.11 a/b/g/n + MIMO
Temperature range
-40 to 85°C
Multimedia
PowerVR SGX530 Accelerated 2D and 3D
Product Longevity
2030
Ethernet
1x 10/100Mbps + 1x 10/100/1000Mbps

Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
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Specifications
CPU Name
Texas Instruments AM335x ( AM3354, AM3352, AM3358, AM3359 )
CPU Type
Cortex™-A8
CPU Cores
1 Core
CPU Clock (Max)
1.0 GHz
Integer performance (DMIPS)
Up to 1,440
RAM
128 - 512 MB DDR3
SLC NAND
128 - 1024 MB SLC NAND
Multimedia
2D/3D Graphics Acceleration
PowerVR SGX530 Accelerated 2D and 3D
Display
Parallel RGB
1400 x 1050 24-bit
Touch controller
Resistive, Capacitive
Audio
Headphone driver
Yes
Microphone
Analog
Line In/Out
Yes
Connectivity
SD / MMC
x2
USB Host / Device
USB 2.0 : 1x Host, 1x OTG
UART
x4, up to 3.6 Mbps
I2C
x2
SPI
x1
CAN Bus
x2
RTC
on-SoM
External Bus
GPMC
Networking
Ethernet
10/100 Mbps + 10/100/1000 RGMII
WiFi
Certified 802.11 a/b/g/n + MIMO
Bluetooth
5.1 + CSA2 support / BLE
Linux
Yocto
Mechanical Specifications
Dimensions (W x L)
67.8 x 38.6 mm
Electronic Specifications
Supply voltage
3.3 V
Digital I/O voltage
3.3 V
Environmental Specifications
Commercial operating temperature
0 to 70°C
Extended operating temperature
-20 to 70°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
VAR-SOM-AM335[x]_V2_[xxxx]C_[xxx]R_[xxx]N_[AC]_[EC]_[W[B][D]]_[x]T_LO
AM335[x]:
CPU type: 2: AM3352 , 4 : AM3354 , 6 : AM3356 , 8 : AM3358
[xxxx]C:
Clock speed: 600 MHz : 600C, 800 MHz : 800C, 1 GHz : 1000C
[xxx]R:
RAM size: 128 MB : 128R,256 MB : 256R, 512 MB : 512R
[xxx]N:
NAND size: 128 MB : 128N, 256 MB : 256N, 512 MB : 512N, 1024 MB : 1024N
[AC]:
Audio Codec
[EC]:
10 / 100 Mbps Ethernet PHY
[W[B][D]]:
W: Certified Built-in WiFi 802.11 b/g/n
WB: Built-in certified WiFi 802.11 b/g/n + Bluetooth 5.1 + CSA2 support/BLE (CT/ET only)
WD: Built-in certified WiFi 802.11 a/b/g/n with MIMO
WBD: Built-in certified WiFi 802.11 a/b/g/n with MIMO + Bluetooth 5.1 + CSA2 support/BLE
WB: Built-in certified WiFi 802.11 b/g/n + Bluetooth 5.1 + CSA2 support/BLE (CT/ET only)
WD: Built-in certified WiFi 802.11 a/b/g/n with MIMO
WBD: Built-in certified WiFi 802.11 a/b/g/n with MIMO + Bluetooth 5.1 + CSA2 support/BLE
[x]T:
C : 0 to 70°C,E : -20 to 70°C, I : -40 to 85°C
Documentation
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Why Variscite?

Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.

Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.

Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.

Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Your OS Decision Matters
29.04.2026 Nathan Drude







