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- VAR-SOM-SD600 Qualcomm Snapdragon 600
VAR-SOM-SD600
Qualcomm Snapdragon 600
The VAR-SOM-SD600 supports the Qualcomm Snapdragon™ 600 (APQ8064) 1.7 GHz quad Krait™ processor. With a staggering 22,400 DMIPS processing power and highly optimized power consumption Variscite have successfully delivered a premier commercial processor into the embedded arena. High-resolution displays, advanced multimedia support and broad network compatibility are just some of the features that ensure a richer experience in various embedded segments and applications.
Highlights
CPU
Up to 1.7GHz Qualcomm Snapdragon™ 600 (APQ8064)
Multimedia
1080p60 H.264 Decode, 1080p60 H.264 Encode
Display
HDMI, LVDS, DSI
Certified WiFi/Bluetooth
802.11 b/g/n + optional MIMO
Memory
2048 MB DDR3
Ethernet
10/100/1000 Mbps
Temperature range
-20-85 C
Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU Name
Qualcomm Snapdragon™ 600 (APQ8064)
CPU Type
Krait™ 300
CPU Cores
4 cores
CPU Clock (Max)
1.7 GHz
RAM
2048 MB DDR3
eMMC
64 GB eMMC
Multimedia
2D/3D Graphics Acceleration
Adreno 320
Video Encode / Decode
1080p60 H.264 Decode, 1080p60 H.264 Encode
Camera Interfaces
2x CSI
Display
HDMI
v1.4a 1920 x 1080
LVDS
2048 x 1536 24-bit
DSI
2048 x 1536 24-bit
Audio
Headphone driver
Yes
Microphone
Analog / Digital
Digital audio serial interface
I25
Line In/Out
Yes
Connectivity
SD / MMC
x2
USB Host / Device
USB 2.0 : 3x Host, 1x OTG
UART
x3, up to 4 Mbps
I2C
up to x6
SPI
up to x6
S-ATA
SATA I interface, 1.5 Gbps
RTC
On SoM
PCI-Express
Gen 2.0
Networking
Ethernet
10/100/1000 Mbps
WiFi
802.11 b/g/n + optional MIMO
Bluetooth
4.0
Linux
Yes
Android
Yes
Mechanical Specifications
SoM Interface
MXM 3.0, 314 pins
Dimensions (W x L)
82 x 56 mm
Electronic Specifications
Supply voltage
3 - 4.5 V
Digital I/O voltage
1.8 V
Environmental Specifications
Commercial temperature
0 to 70°C
Extended temperature
-20 to 70°C
Industrial temperature
-20 to 85°C
VAR-SOM-SD600_1700C_[xxxx]R_[xxx]G_[EC]_[AC]_[WB]_[x]T
[xxx]R:
1024 MB : 1024R, 2048 MB : 2048R
[xxx]N:
4 GB : 4G, 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G
[EC]:
10/100/1000Mbps Ethernet PHY
[AC]:
Audio Codec
[WB]:
WiFi 802.11 b/g/n + Bluetooth 4.0
[x]T:
C : 0 to 70°C, E : -20 to 70°C, I : -20 to 85°C
Our Long-Standing Partnerships
Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.
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Why Variscite?
Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.
Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.
Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.
Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
09.10.2024 Software releases
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Newsroom
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Blog
Your OS Decision Matters
29.04.2026
