Highlights
CPU
4x 1.2 GHz Cortex-A35 + Cortex-M4F NXP i.MX 8X
High Speed Interfaces
2x USB3.0, 2x GbE, PCIe
Memory
4 GB RAM, 128 GB eMMC
Temperature range
-40 to 85°C
Video Encode / Decode
4K H.265 Decode, 1080p H.264 Encode/Decode
Product Longevity
2035

Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU Name
NXP iMX 8X
CPU Type
4x Cortex-A35
CPU Cores
4 Cores
CPU Clock (Max)
1.2 GHz Cortex™-A35
Real-time co-processor
264MHz Cortex-M4F
DSP
HiFi 4 DSP
Integer performance (DMIPS)
Up to 8,540
RAM
1 - 4 GB LPDDR4
eMMC
8 - 128 GB
Multimedia
2D/3D Graphics Acceleration
Vivante GC7000Lite
Video Encode / Decode
4K H.265 Decode, 1080p H.264 Encode/Decode
Camera Interfaces
1x MIPI-CSI2, 1x parallel CSI 8/10-bit
Display
Parallel RGB
Parallel LCD up to 720p60 24-bit
LVDS
Dual 1920x1080 24-bit
DSI
MIPI-DSI 1920x1200 24-bit
Touch controller
Resistive, Capacitive
Audio
Headphone driver
Yes
Microphone
Digital, Analog (stereo)
Digital audio serial interface
ESAI/4x I2S(SAI), S/PDIF
Line In/Out
Yes
Connectivity
SD / MMC
x1
USB Host / Device
USB 3.0/2.0: 1x OTG, USB 2.0: 1x Host/Device
UART
x6, up to 4 Mbps
I2C
x6
SPI
x4
CAN Bus
3 x CAN/CAN-FD (Flexible Data-Rate)
RTC
On carrier
JTAG
x1 (via optional header)
Keypad
x1, 4x4 matrix
QSPI
x1
PCI-Express
Gen 3.0
ADC
6 x 12bit
Networking
Ethernet
2x 10/100/1000 Mbps
Linux
Yocto, Debian, Boot2Qt
Android
Yes
FreeRTOS
Yes
Mechanical Specifications
Dimensions (W x L)
67.6 x 51.6 mm
Electronic Specifications
Supply voltage
3.3 V
Digital I/O voltage
3.3 V
Environmental Specifications
Extended operating temperature
-25 to 85°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
VAR-SOM-MX8X[xx]_[xxxx]C_[xxxx]R_[xx]G_[AC]_[EC]_[TP]_[ADC]_[X]T
MX8X[xx]:
CPU type: QuadXPlus 4x Cortex A35: QP
[xxxx]C:
CPU clock speed: 1200MHz Cortex A35: 1200C
[xxxx]R:
LP-DDR4: 1024MB: 1024R, 2048 MB: 2048R, 4096 MB: 4096R
[xx]G:
eMMC: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G, 128 GB : 128G
[AC]:
Audio Codec
[EC]:
GbE PHY
[TP]:
Resistive touch panel controller
[ADC]
With ADC and Cortex M4 UART (instead of QSPI/GPIOs)
[x]T:
E: -25 to 85°C, I: -40 to 85°C
Note: All options in [brackets] are optional add-ons that can be either removed or selected from a list of options
Documentation
Our Long-Standing Partnerships
Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.

Evaluation Kit
VAR-SOM-MX8X Evaluation Kits
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Why Variscite?

Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.

Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.

Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.

Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Your OS Decision Matters
29.04.2026







