Highlights
CPU
800MHz Dual/Quad Cortex™-A9 NXP i.MX6
Power Consumption
Only 8mA in suspend
Certified WiFi/Bluetooth
802.11 a/b/g/n + MIMO+ 5.1 + CSA2 support / BLE
Temperature range
-20 to 85°C
Dimensions
Only 50 x 20 mm
Product Longevity
2029
Display
Dual 1920 x 1200 24-bit

Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU Name
NXP/Freescale i.MX6
CPU Type
Cortex™-A9 MPCore™
CPU Cores
2-4 Cores
CPU Clock (Max)
800 MHz
Integer performance (DMIPS)
Up to 8,000
RAM
1024 - 2048 MB LPDDR2
eMMC
8 - 64 GB
Multimedia
2D/3D Graphics Acceleration
Vivante™ GC2000 Accelerated 2D and 3D
Video Encode / Decode
1080p60 H.264 Decode, 1080p30 H.264 Encode
Camera Interfaces
1x CSI, 1x CPI
Display
HDMI
v1.4 1920 x 1080
LVDS
Dual 1920 x 1200 24-bit
DSI
1280 x 720 24-bit
Touch controller
Capacitive
Audio
Headphone driver
Yes
Microphone
Digital
Digital audio serial interface
S/PDIF
Line In/Out
Yes
Connectivity
SD / MMC
x1
USB Host / Device
USB 2.0 : 1x Host, 1x OTG
UART
x5, up to 5 Mbps
I2C
x3
SPI
x4
RTC
On carrier
PCI-Express
Gen 2.0
CAN Bus
x2
Networking
Ethernet
10/100/1000 Mbps RGMII
WiFi
Certified 802.11 a/b/g/n + MIMO
Bluetooth
5.1 + CSA2 support / BLE
Linux
Yocto, Debian, Boot2Qt
Android
Yes
Mechanical Specifications
Dimensions (W x L)
50.0 x 20.0 mm
Electronic Specifications
Supply voltage
3.7 V
Digital I/O voltage
3.3 V
Environmental Specifications
Commercial operating temperature
0 to 70°C
Extended operating temperature
-20 to 85°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
DART-MX6[x]_800C_[xxxx]R_[xx]G_[AC]_[WB[D]_[x]T_LO
MX6[x]:
CPU type: Quad : [Q], Dual : [D]
[xxxx]R
RAM size: 1024 MB : 1024R, 2048 MB : 2048R
[x]G:
eMMC size: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G
[AC]:
Audio Codec
[WB[D]]
WB: Built-in certified WiFi 802.11 b/g/n + Bluetooth 5.1 + CSA2 support/BLE (CT only)
WBD: Built-in certified WiFi 802.11 a/b/g/n with MIMO + Bluetooth 5.1 + CSA2 support / BLE
WBD: Built-in certified WiFi 802.11 a/b/g/n with MIMO + Bluetooth 5.1 + CSA2 support / BLE
[x]T:
C : 0 to 70°C, E : -20 to 85°C, I : -40 to 85°C
Documentation
Our Long-Standing Partnerships
Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.

Evaluation Kit
DART-MX6 Evaluation Kits
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Why Variscite?

Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.

Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.

Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.

Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Your OS Decision Matters
29.04.2026







