Watch the ‘Getting Started with VAR-SOM-MX93 Development Kit’ based on NXP i.MX93 processor and learn about the SoM’s features and connectivity options.
The VAR-SOM-MX93 System on Module / Computer on Module is a member of the VAR-SOM Pin2Pin family, offering maximum scalability range and extended lifetime availability.
Powered by a 1.7GHz Dual Cortex™-A55 NXP’s iMX93 processor with 250MHz Cortex™-M33 real-time co-processor, the VAR-SOM-MX93 provides dedicated Machine Learning capabilities, NPU 0.5 TOPS, and energy flex architecture.
This cost-optimized SoM delivers industrial features such as dual CAN bus, dual GbE, and industrial temperature grade. In addition, it offers a wide set of peripherals and connectivity options such as audio in/out, camera inputs, certified dual-band WiFi, Bluetooth/BLE, 2x USB, and several display outputs.
The kit provides an excellent showcase for VAR-SOM-MX93 performance and can serve as a comprehensive evaluation platform for assessment and application development purposes.
For additional information, visit the VAR-SOM-MX93 Evaluation kit.
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As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
