Now with boosted Certified WiFi/Bluetooth Module supporting 802.11 ac/a/b/g/n
With a much faster throughput of the 802.11ac and a more reliable 5GHz support, the DART-6UL-5G is the perfect choice for both Medical and data-intensive IoT applications.
The DART-6UL-5G variants will function in parallel with two successful early variants: The initial i.MX 6UL which were boosted recently by a processing speed grade of 696MHz, as well as the low-power i.MX 6ULL variants. All variants are available at a very competitive price-point which starts at 24 USD.
Fully compatible with further DART-6UL variants, the DART-6UL-5G reflects identical features and interface selection. Small-sized at a mere 25 x 50 mm, maximized price-power, extended temperature range ability of -40 to 85 and a 15-years longevity. Thanks to the broad range of features, the platform can be easily employed in new applications, rapidly gaining ground. These include the Internet-of-Things, embedded systems, battery-operated products and embedded industrial-grade solutions.
DART-6UL-5G key features include:
- Optimized size: Only 25 mm x 50 mm x 4 mm
- NXP i.MX 6UltraLite and 6ULL 528 MHz / 696 MHz ARM Cortex-A7 with optional security features
- Up to 512 MB DDR3L and 512 MB NAND / 32 GB eMMC
- Certified WiFi/Bluetooth 802.11 ac/a/b/g/n Dual Band 2.4/5 GHz
- Dual 10/100Mbps Ethernet
- 2D Pixel acceleration engine
- Display: 24-bit parallel RGB up to WXGA
- Touchscreen controller
- Dual USB 2.0 OTG (Host/Device)
- Audio In/Out
- Dual CAN, UART, I2C, SPI, PWM, ADC
- Parallel camera input
- Industrial temperature grade
- OS: Linux Yocto, Linux Debian, Android
The VAR-6ULCustomBoard carrier board complements an attractive full reference kit of the DART-6UL SoM, which can be used for customers’ evaluation, development and end-product mass production.
VAR-6ULCustomBoard – Single Board Computer SBC and development kit
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As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
