Introducing the AM62P System on Module for Cost-Effective Multimedia Applications
Variscite has announced the release of the VAR-SOM-AM62P System on Module (SoM). Designed to deliver advanced multimedia functionality while maintaining cost efficiency.
Powered by the Texas Instruments Sitara AM62Px processor, the VAR-SOM-MX62P is an enhanced version of the VAR-SOM-AM62. It offers increased video acceleration, a more powerful 3D GPU, and multi-screen support.
Key Features of the VAR-SOM-AM62P
The VAR-SOM-AM62P incorporates features and connectivity options that make it suitable fora variety of applications, such as industrial automation, medical devices, multimedia, and IoT:
- Processing power: A 1.4GHz quad-core Cortex®-A53 processor combined with an 800MHz Cortex-R5F real-time co-processor
- Enhanced multimedia: 3D GPU with OpenGL ES 3.2 & Vulkan 1.2, 3x display support and H.264/H.265 Video Encoder/Decoder
- Extensive connectivity: Certified WiFi 6 802.11ax/ac/a/b/g/n with 802.15.4, Bluetooth 5.4 + BLE, 2x Gigabit Ethernet, 4x CAN-FD, camera input, audio interfaces, and 2x USB
- Industrial-grade temperature range: -40°C to 85°C
Seamless Scalability with the VAR-SOM Pin2Pin Family
The VAR-SOM-AM62P is part of the VAR-SOM Pin2Pin family, which allows developers to scale their designs across a wide range of SoMs—from entry-level to high-performance modules—without hardware redesigns. This compatibility reduces development time, cost, and risk while ensuring extended product longevity.
“The launch of Variscite’s new System on Module, powered by TI’s AM62P SoC, enhances our VAR-SOM Pin2Pin family with cost-optimized solution with advanced multimedia capabilities and ensures seamless scalability with our AM62-based SoM”, said Ofer Austerlitz, VP Business Development and Sales for Variscite.
Live Demonstration at Embedded World 2025
Variscite will display the VAR-SOM-AM62P at Embedded World 2025, taking place from March 11–13 in Nuremberg, Germany. Attendees can visit booth 4A-342 to see a demonstration of the module’s capabilities in action.
Contact us to learn how the VAR-SOM-AM62P can elevate your next project.
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As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
