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- VAR-SOM-MX6 NXP/Freescale iMX6
VAR-SOM-MX6
NXP/Freescale iMX6
The VAR-SOM-MX6 sets the bar for unparalleled design flexibility.
Supporting the i.MX6 QuadPlus/Quad/Dual/DualLite/Solo core ARM Cortex-A9, the VAR-SOM-MX6 allows designers to use a single System on Module / Computer on Module in a broad range of applications to achieve short time-to-market for their current innovations, while still accommodating potential R&D directions and marketing opportunities.
This versatile solution’s -40 to 85 °C temperature range, certified WiFi/Bluetooth module including optional Dual Band 2.4 / 5 GHz and MIMO and Dual CAN support is ideal for industrial applications, while 1080p video and graphics accelerations make it equally suitable for intensive multimedia applications.
The VAR-SOM-MX6 is Pin2Pin compatible within Variscite's VAR-SOM family, giving engineers an easy upgrade path and the flexibility to scale performance to fit evolving product requirements.
* For the complete Pin2pin product list, check the Variscite Pin2Pin System on Module families.
** The Pin2Pin compatibility depends on pinmux options; please verify the detailed pinout table in the related SoM to confirm compatibility is maintained in your specific design.
Highlights
CPU
Up to 4x 1.2GHz Cortex™-A9 NXP i.MX6
2D/3D Graphics Acceleration
Vivante™ GC2000 Accelerated 2D and 3D
Certified WiFi/Bluetooth
802.11 a/b/g/n + MIMO, Bluetooth 5.1 /BLE
Temperature range
-40 to 85°C
Power Consumption
Only 13mA in suspend
Product Longevity
2035
Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU Name
NXP/Freescale i.MX6
CPU Type
Cortex™-A9 MPCore™
CPU Cores
1-4 Cores
CPU Clock (Max)
1.2 GHz
Integer performance (DMIPS)
Up to 12,000
RAM
256 - 4096 MB DDR3
SLC NAND
128 - 1024 MB SLC NAND
eMMC
8 - 128 GB
Multimedia
2D/3D Graphics Acceleration
Vivante™ GC2000 Accelerated 2D and 3D (note: in QuadPlus 50% enhanced performance)
Video Encode / Decode
Up to 1080p60 H.264 Decode, 1080p30 H.264 Encode
Camera Interfaces
1x CSI, 2x CPI
Display
HDMI
v1.4 1920 x 1080
LVDS
Dual 1920 x 1200 24-bit
DSI
1280 x 720 24-bit
Touch controller
Resistive, Capacitive
Audio
Headphone driver
Yes
Microphone
Digital
Digital audio serial interface
S/PDIF
Line In/Out
Yes
Connectivity
SD / MMC
x1
USB Host / Device
USB 2.0 : 1x Host, 1x OTG
UART
x5, up to 5 Mbps
I2C
x3
SPI
x3
S-ATA
SATA 2
RTC
On carrier
PCI-Express
Gen 2.0
External Bus
EIM
CAN Bus
x2
Networking
Ethernet
10/100/1000 Mbps
WiFi
Certified 802.11 a/b/g/n + MIMO
Bluetooth
5.1 + CSA2 support / BLE
Linux
Yocto, Debian, Boot2Qt
Android
Yes
Mechanical Specifications
Dimensions (W x L)
67.8 x 51.5 mm
Electronic Specifications
Supply voltage
3.3 V
Digital I/O voltage
3.3 V
Environmental Specifications
Commercial operating temperature
0 to 70°C
Extended operating temperature
-20 to 70°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
VAR-SOM-MX6[xx]_V2_[xxxx]C_[xxxx]R_[xxxx]N_[x]G_[AC]_[EC]_[TP]_[WB[D]]_[LB]_[x]T_LO
MX6[xx]:
CPU type: QuadPlus : [QP], Quad : [Q], Dual : [D], Dual Lite :[DL], Solo: [S]
[xxxx]C:
Clock speed: 1200MHz : 1200C, 1000MHz : 1000C, 800MHz : 800C
[xxx]R:
RAM size: 256 MB : 256R, 512 MB : 512R, 1024 MB : 1024R, 2048 MB : 2048R, 4096 MB : 4096R
[xxx]N:
NAND size: 128 MB : 128N, 256 MB : 256N, 512 MB : 512N
[x]G:
eMMC size: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G
[EC]:
10/100/1000Mbps Ethernet PHY
[AC]:
Audio Codec
[TP]:
4-wire Touch Panel.
Note: Capacitive touch is natively supported through I2C in the base configuration
Note: Capacitive touch is natively supported through I2C in the base configuration
[WB[D]]:
WB: Built-in certified WiFi 802.11 b/g/n + Bluetooth 5.1 + CSA2 support/BLE (CT/ET only)
WBD: Built-in certified WiFi 802.11 a/b/g/n with MIMO + Bluetooth 5.1 + CSA2 support/BLE
WBD: Built-in certified WiFi 802.11 a/b/g/n with MIMO + Bluetooth 5.1 + CSA2 support/BLE
[LB]:
Local Bus / JTAG expansion connector
[x]T:
C : 0 to 70°C, E : -20 to 70°C, I : -40 to 85°C
Documentation
Our Long-Standing Partnerships
Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.
Evaluation Kit
VAR-SOM-MX6 Evaluation Kits
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Why Variscite?
Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.
Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.
Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.
Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
09.10.2024 Software releases
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Newsroom
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Blog
Your OS Decision Matters
29.04.2026
