WiFi certification of your end product using Variscite's System-on-Module
Variscite’s System on Modules (SoMs) offer a variety of configuration options, including various CPU speed grades, memory/storage capacities, temperature grades, and several add-on features such as audio codec, Ethernet physical layer, and WiFi/Bluetooth.
To facilitate our customers’ end-products certification process, Variscite integrated in its SoM solutions certified WiFi modules from leading vendors such as Texas Instruments and Laird Connectivity.
In recent years, Variscite’s System on Module solutions include either Laird’s Sterling LWB for certified single band WiFi 802.11b/g/n (marked as WB in Variscite’s module configuration) or Laird’s Sterling LWB5 dual-band 802.11ac/a/b/g/n (marked as WBD in Variscite’s module configuration).
Both are based on Cypress chipsets that also embed Bluetooth/BLE4.2 capabilities to complete the wireless connectivity combo solution.
The Sterling LWB and LWB5 were fully certified by Laird to comply with leading certification standards, including FCC, IC, CE (RED), and more.
To maintain the certifications for its SoM solutions, Variscite copied the exact design done by Laird, including schematics and layout, thus practically elevating Laird’s certification to the SoM level by using the modular certification procedure.
Any customer who wishes to simplify his end-product certification can base his RF design on Laird’s certifications. By adhering to certain design rules, such as selecting an RF antenna with lower/equal gain to the one used during Larid’s certification, our customers can reduce certification costs, time, and efforts to the minimum.
Naturally, it is always advised to consult with a recognized certification lab prior, during and after the system design to ensure the end-product complies with the requirements of the targeted certification standards.
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As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
